MBRS140LT3 Datasheet, PDF (1/4 Pages) Motorola, Inc – Surface Mount Schottky Power Rectifier(SMB Power Mount Power Package)

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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by MBRS140LT3/D
Advance Information
Surface Mount
Schottky Power Rectifier
MBRS140LT3
SMB Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal–to–silicon power
rectifier. Features epitaxial construction with oxide passivation and metal
overlay contact. Ideally suited for low voltage, high frequency switching power
supplies; free wheeling diodes and polarity protection diodes.
• Compact Package with J–Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guardring for Over–Voltage Protection
• Low Forward Voltage Drop
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
40 VOLTS
Mechanical Characteristics:
• Case: Molded Epoxy
• Epoxy Meets UL94, VO at 1/8″
• Weight: 95 mg (approximately)
• Polarity: Notch in Plastic Body Indicates Cathode Lead
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Available in 12 mm Tape, 2500 Units per 13″ Reel, Add “T3” Suffix to Part Number
• Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
• Marking: B14L
CASE 403A–03
SMB
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
40
VRWM
VR
Average Rectified Forward Current (At Rated VR, TC = 110°C)
IO
1.0
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 100 kHz, TC = 110°C)
IFRM
2.0
Non–Repetitive Peak Surge Current
IFSM
40
(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)
Volts
Amps
Amps
Amps
Storage / Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change (Rated VR, TJ = 25°C)
THERMAL CHARACTERISTICS
Thermal Resistance — Junction–to–Lead ⁽²⁾
Thermal Resistance — Junction–to–Ambient ⁽²⁾
ELECTRICAL CHARACTERISTICS
Tstg, TC
TJ
dv/dt
R_θJL
R_θJA
– 55 to +150
– 55 to +125
10,000
24
80
°C
°C
V/ms
°C/W
Maximum Instantaneous Forward Voltage ⁽¹⁾
see Figure 2
VF
(IF = 1.0 A)
(IF = 2.0 A)
TJ = 25°C
0.5
0.6
TJ = 125°C
0.425
0.58
Maximum Instantaneous Reverse Current
see Figure 4
IR
(VR = 40 V)
(VR = 20 V)
TJ = 25°C
0.4
0.02
TJ = 100°C
10
5.0
This document contains information on a new product. Specifications and information herein are subject to change without notice.
(1) Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤ 2.0%.
(2) Mounted with minimum recommended pad size, PC Board FR4.
Volts
mA
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