English
Language : 

V54C3256164VALT6 Datasheet, PDF (1/52 Pages) Mosel Vitelic, Corp – 256Mbit SDRAM 3.3 VOLT, TSOP II / SOC BGA / WBGA PACKAGE 16M X 16, 32M X 8, 64M X 4
MOSEL VITELIC
V54C3256(16/80/40)4V(T/S/B)
256Mbit SDRAM
3.3 VOLT, TSOP II / SOC BGA / WBGA
PACKAGE 16M X 16, 32M X 8, 64M X 4
PRELIMINARY
System Frequency (fCK)
Clock Cycle Time (tCK3)
Clock Access Time (tAC3) CAS Latency = 3
Clock Access Time (tAC2) CAS Latency = 2
6
166 MHz
6 ns
5.4 ns
5.4 ns
7PC
143 MHz
7 ns
5.4 ns
5.4 ns
7
143 MHz
7 ns
5.4 ns
6 ns
8PC
125 MHz
8 ns
6 ns
6 ns
Features
■ 4 banks x 4Mbit x 16 organization
■ 4 banks x 8Mbit x 8 organization
■ 4 banks x16Mbit x 4 organization
■ High speed data transfer rates up to 166 MHz
■ Full Synchronous Dynamic RAM, with all signals
referenced to clock rising edge
■ Single Pulsed RAS Interface
■ Data Mask for Read/Write Control
■ Four Banks controlled by BA0 & BA1
■ Programmable CAS Latency: 2, 3
■ Programmable Wrap Sequence: Sequential or
Interleave
■ Programmable Burst Length:
1, 2, 4, 8 for Sequential Type
1, 2, 4, 8 for Interleave Type
■ Multiple Burst Read with Single Write Operation
■ Automatic and Controlled Precharge Command
■ Random Column Address every CLK (1-N Rule)
■ Power Down Mode
■ Auto Refresh and Self Refresh
■ Refresh Interval: 8192 cycles/64 ms
■ Available in 54 Pin TSOP II, 60 Ball WBGA and
SOC BGA
■ LVTTL Interface
■ Single +3.3 V ±0.3 V Power Supply
Description
The V54C3256(16/80/40)4V(T/S/B) is a four
bank Synchronous DRAM organized as 4 banks x
4Mbit x 16, 4 banks x 8Mbit x 8, or 4 banks x 16Mbit
x 4. The V54C3256(16/80/40)4V(T/S/B) achieves
high speed data transfer rates up to 166 MHz by
employing a chip architecture that prefetches multi-
ple bits and then synchronizes the output data to a
system clock
All of the control, address, data input and output
circuits are synchronized with the positive edge of
an externally supplied clock.
Operating the four memory banks in an inter-
leaved fashion allows random access operation to
occur at higher rate than is possible with standard
DRAMs. A sequential and gapless data rate of up to
166 MHz is possible depending on burst length,
CAS latency and speed grade of the device.
Device Usage Chart
Operating
Temperature
Range
0°C to 70°C
Package Outline
T/S/B
6
•
•
Access Time (ns)
7PC
7
•
•
8PC
•
Power
Std.
L
•
•
Temperature
Mark
Blank
V54C3256(16/80/40)4V(T/S/B) Rev. 1.6 September 2002
1