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MSC0305W Datasheet, PDF (2/6 Pages) MORE Semiconductor Company Limited – -30V(D-S) Dual P-Channel Enhancement Mode Power MOS FET
MSC0305W
Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
On Characteristics (Note 3)
Gate Threshold Voltage
Drain-Source On-State Resistance
Forward Transconductance
Dynamic Characteristics (Note4)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics (Note 4)
Turn-on Delay Time
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
Symbol
Condition
Min Typ
BVDSS
IDSS
IGSS
VGS=0V ID=-250μA
VDS=-24V,VGS=0V
VGS=±20V,VDS=0V
-30 -33
-
-
-
-
VGS(th)
RDS(ON)
gFS
VDS=VGS,ID=-250μA
VGS=-10V, ID=-5.1A
VGS=-4.5V, ID=-4.2A
VDS=-15V,ID=-4.5A
-1 -1.6
-
48
-
73
4
7
Clss
- 520
VDS=-15V,VGS=0V,
Coss
- 130
F=1.0MHz
Crss
-
70
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
-
7
VDD=-15V, ID=-1A,
VGS=-10V,RGEN=6Ω
-
13
-
14
-
9
-
12
VDS=-15V,ID=-5.1A,VGS=-10V -
2.2
-
3
VSD
VGS=0V,IS=-1.7A
-
-
Max
-
-1
±100
-3
55
105
-
-
-
-
-
-
-
-
-
-
-
-1.2
Unit
V
μA
nA
V
mΩ
mΩ
S
PF
PF
PF
nS
nS
nS
nS
nC
nC
nC
V
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
MORE Semiconductor Company Limited
http://www.moresemi.com
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