76650-0232 Datasheet, PDF (1/3 Pages) MolexKits – Plugs, Vertical Receptacles

General Information
Kit Part Number:
Connector Type:
Solution:
Molex Family:
Certificates:
Country of Origin:
Specifications
Circuit Size:
Current Rating:
Mounting Style:
Orientation:
Pitch:
Speed:
Stack Height:
Style:
Voltage Rating:
Product Hightlights
Datasheet for 76650-0232
76650-0232
Board-to-Board, Wire-to-Board
High Speed
Plateau HS Mezz™, SEARAY*, SEARAY* Slim
N/A
Kit assembled in U.S.A
18, 200, 300, 400, 48
1.5A, 2.7A
PCB Through Hole, SMT (Surface Mount Technology)
Plugs, Vertical Receptacles
1.20mm (.047"), 1.27mm (.050") by 1.27mm (.050")
10 Gbps (Gigabits Per Second)
Assorted Stack Heights from 4.5mm-17mm
Mezzanine
240V, 30V
SEARAY* Slim is a solution armed with the benefits of the standard SEARAY* family but with a width similar to 2 row mezzanine products. The
design gives a system a highly compact solution but with speed capabilities of 12.5 Gbps, a level of performance most other 2 row products
cannot achieve today. As system level speeds approach 5Gbps and beyond, SEARAY* is an enticing mezzanine architecture that provides
headroom for future generation iterations as protocol speeds continue to increase. Plateau HS Mezz™ utilizes proprietary Plateau Technology™
(plated gold housing) to provide a high-speed high-density mezzanine connector system for differential and single-ended signal applications. The
gold-plated plastic shields each differential pair from neighboring pairs, lowering crosstalk and improving signal clarity. Different stack heights and
circuit sizes provide flexibility in design and grounding the conductive housing eliminates the need for individual ground pin designations within the
connector. The SEARAY* board-to-board connector is designed for computer, networking, telecom, storage and general market applications with
high pin-count devices or memory modules that are mounted on mezzanine or module PC Boards (PCBs). The design of our SEARAY* has
superior electrical and mechanical features that are cost competitive. The unique, Molex patented, solder charge technology results in better
process yields a lower applied cost versus equivalent BGA connector products. Circuit sizes range from 160 through 500 positions, and mated
stack heights cover 7mm (.276") to 13mm (.512").
Features and Benefits
• Advanced gold-plated housings with integrated shielding system
• Two points of contact on each signal
• Multiple stack heights
• Data rates up to 12.5Gbps provide excellent signal clarity and large bandwidth
• Narrow body width comparable to 2 row SMT has a minimal PCB footprint for high density board designs
• Robust contact design prevents stubbing and damage in mating interface
• Unique patented solder attach is more cost effective and reliable than BGA
• SEARAY* footprint is compatible with other 1.27mm(.050") by 1.27mm(.050") products
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