76650-0119 Datasheet, PDF (1/2 Pages) MolexKits – High Density Mezz Interconnect Plug and Receptacle

1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0119
General Information
Part Number:
76650-0119
Manufacturer:
Title:
Description:
Molex / Waldom
SEARAY Slim Connector Kit
High Density Mezz Interconnect Plug and Receptacle
Product Family: SEARAY Slim
Certificates:
RoHS Compliant, China RoHS, UL, CSA
Country of Origin: Kit assembled in U.S.A.
Specifications
Design
Configuration:
Pitch:
Connector Type:
Mounting
Orientation:
Circuit Sizes:
Current Rating:
Voltage:
Board-to-Board
1.27mm (.050") by 1.27mm (.050") Pitch
Receptacle and Plug
Vertical
80 and 160
2.7 Amps
240 Volts
Product Highlights
SEARAY Slim is a solution armed with the benefits of the standard SEARAY family
but with a width similar to 2 row mezzanine products. The design gives a system a
highly compact solution but with speed capabilities of 12.5 Gbps, a level of
performance most other 2 row products cannot achieve today. As system level
speeds approach 5Gbps and beyond, SEARAY is an enticing mezzanine
architecture that provides headroom for future generation iterations as protocol
speeds continue to increase.
Features and Benefits
• Narrow body width comparable to 2 row
SMT has a minimal PCB footprint for high
density board designs
• Data rates up to 12.5Gbps provide
excellent signal clarity and large bandwidth
• Robust contact design prevents stubbing
and damage in mating interface
Applications
• Mezzanine add-on cards
• Memory expansion
• I/O expansion
• Controller cards
• Motherboard personality cards
For additional Molex / Waldom Design and Solution kits please go to www.molexkits.com
*SEARAY is a trademark of Samtec, Inc.
Page 1 of 2