0739435200 Datasheet, PDF (2/4 Pages) Molex Electronics Ltd. – 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder TailClosed End, 144 Circuits

Termination Interface: Style
Through Hole
Electrical
Current - Maximum per Contact
Data Rate
Voltage - Maximum
1A
1.0 Gbps
250V AC
Material Info
Reference - Drawing Numbers
Packaging Specification
PK-70873-0818
Sales Drawing
SD-73943-001
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
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