0737820100 Datasheet, PDF (2/5 Pages) Molex Electronics Ltd. – 2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise VerticalSMC, Closed End Option, 72 Circuits

Termination Interface: Style
Through Hole
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Voltage - Maximum
1A
1.0 Gbps
72
100V AC
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
5
Wave Capable (TH only)
1
260
Material Info
Reference - Drawing Numbers
Packaging Specification
PK-70873-0870
Product Specification
PS-73780-999
Sales Drawing
SD-73782-001
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
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