English
Language : 

0713492023 Datasheet, PDF (2/5 Pages) Molex Electronics Ltd. – 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded50 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
Sales Drawing
30
Reflow Capable (SMT only)
3
245
PK-70873-0018, PK-70873-0019
PS-71349-001
SDA-71349-****
This document was generated on 05/31/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION