0462070004 Datasheet, PDF (2/4 Pages) Molex Electronics Ltd. – 4.20mm (.165") Pitch Mini-Fit RTC™ Reflow High Temperature Compatible Header,Dual Row, Vertical, 4 Circuits, 1.57mm (.062") PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating

Polarized to PCB
Shrouded
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Electrical
Current - Maximum per Contact
Voltage - Maximum
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
Sales Drawing
Yes
Fully
No
Yes
-40°C to +105°C
Through Hole
13A
600V AC (RMS)/DC
30
SMC & Wave Capable (TH only)
3
260
PK-46207-001
PS-46207-001
SD-46207-001
This document was generated on 06/07/2010
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