0440671203 Datasheet, PDF (2/3 Pages) Molex Electronics Ltd. – 3.00mm (.118") Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

Electrical
Current - Maximum per Contact
Voltage - Maximum
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
Sales Drawing
Test Summary
5A
250V
30
SMC & Wave Capable (TH only)
3
260
PK-70873-0314
PS-43045
SD-44067-001
TS-43045-002
This document was generated on 05/24/2010
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