0015800143 Datasheet, PDF (2/7 Pages) Molex Electronics Ltd. – 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

Polarized to Mating Part
Polarized to PCB
Shrouded
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Electrical
Current - Maximum per Contact
Voltage - Maximum
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
Material Info
Old Part Number
Reference - Drawing Numbers
Packaging Specification
Product Specification
Sales Drawing
Yes
No
Fully
No
No
-55°C to +105°C
Through Hole
2.5A
250V
5
SMC & Wave Capable (TH only)
1
245
A-70567-0073
PK-70873-0018
PS-70567
SDA-70567-****
This document was generated on 05/24/2010
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