78588-0002 Datasheet, PDF (1/3 Pages) Molex Electronics Ltd. – Ultra-Low-Profile DDR3 DIMM Sockets

Molex’s ultra-low-profile DDR3 DIMM sockets optimize
vertical space- and power-savings in ATCA* blade
systems using high-density memory modules
DDR3 is an established DDR DRAM interface technology that offers
more bandwidth and higher performance at lower power for demanding
memory applications in desktop PCs, servers and notebook computers.
It finds expanding use for high-performance embedded systems in
telecommunication, networking and storage systems, advanced computing
platforms and industrial controls. DDR3 supports data rates of 800 to 1600
Mbps with clock frequencies of 400 to 800 MHz (respectively); effectively
doubling the speed of DDR2. With a standard operating voltage of 1.5V,
DDR3 cuts power consumption of DDR2 by up to 30%.
A leading manufacturer of internal memory module sockets, Molex offers
Ultra-Low-Profile DDR3 DIMM sockets with Low Level Contact Resistance
only 10milliohms (maximum initial). These sockets support the unregistered
DDR3 DIMMs as well as Registered DIMMs (RDIMMs) for reduced power
consumption in data systems.
With a seating plane of only 1.10mm – the lowest known in the industry
– the sockets provide optimum design flexibility by allowing the use of
very low-profile memory modules with seating heights below 2.80mm
(maximum) in ATCA blade systems. For applications requiring conformance
to ATCA Board Mechanics Specifications where component heights cannot
exceed 21.33mm from ‘side 1 of the front board PCB’ (specification
definitions), these sockets are excellent as they free up to 20.23mm of
vertical space above the PCB for the mounting of high-density DIMMs.
The sockets’ reduced latch-actuation angles use less PCB real-estate than
standard DIMM sockets to enable the addition of neighbouring components.
The ultra-low-profile DIMM sockets also have a smaller overall (7.40 by
155.00mm) real estate than that according to JEDEC Specifications (7.75 by
165.00mm), making them space-savers for complex base stations, server
farms and voice gateways where chassis mechanics, power, thermal and
airflow conditions are critical design factors.
The sockets have glass-filled, high-temperature Nylon housing that enable
wave soldering and high-temperature IR reflow operations. The socket
latches are reinforced with metal to provide robust module retention and
ejection. They also ensure module ejection forces of no less than those in
2.40 or 3.30mm seating plane sockets. Available in black or white parts, the
sockets are halogen-free.
For more information, visit our website at: www.molex.com/link/ddr3.html.
Ultra-Low-Profile
DDR3 DIMM
Sockets
78588 1.10mm Seating Plane,
Low‑Level Contact
Resistance (LLCR),
Through Hole, Vertical,
240 circuits Halogen-
free, Lead-free
The ultra-low-profile DDR3 DIMM socket
(left) has a lower seating-plane than
standard DDR3 DIMM versions (right)
Features and Benefits
Ultra-low seating plane of 1.10mm height
Low-level contact resistance of 10milliohms
(maximum initial)
Reduced latch-actuation angle
High-temperature, glass-filled socket housing and
latches
Compliance with industry-standard specifications
Frees up vertical module space to allow use of high-
density DIMMs while maintaining the same design
height;
Enables the use of very low-profile modules with
seating heights below 2.80mm (maximum) in ATCA*
blade systems
Supports the use of Registered DIMM (RDIMM)
modules and reduces power consumption in blade
servers
Creates more room for neighbouring components
while improving airflow space around memory module
socket
Provides robust module retention and ejection; able to
withstand wave solder and IR reflow temperatures
Accepts JEDEC MO-269 memory modules
*The Advanced Telecom Computing Architecture (AdvancedTCA or ATCA) specifications, denoted PICMG † 3.X, are a series of
PICMG specifications, targeted to requirements for the next generation of ‘carrier grade’ communications equipment. This
series of specifications incorporates the latest trends in high-speed interconnect technologies, next-generation processors and
improved reliability, manageability and serviceability.
†PCI Industrial Computer Manufacturers Group 3.0 specification defines open architecture modular computing components that
can be quickly integrated to deploy high-performance services solutions.