0460152402 Datasheet, PDF (5/13 Pages) Molex Electronics Ltd. – PRODUCT SPECIFICATION FOR Mini-Fit Plus HCS™

PRODUCT SPECIFICATION
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
For details regarding dimensions, materials and terminal platings, refer to the appropriate
sales drawings for further information.
2.3 SAFETY AGENCY APPROVALS
UL File: E29179
CSA Certificate: LR19980
TUV Certificate: R72081037
3.0 APPLICABLE STANDARDS AND SPECIFICATIONS
- EIA-364-1000
- Molex solderability specification SMES-152
4.0 PACKAGING
Parts shall be packaged to protect against damage during normal handling, transit and storage. For
details refer to the Packaging Specification as called out on the applicable product Sales Drawing.
5.0 RATINGS
5.1 VOLTAGE
600 Volts AC RMS or 600 Volts DC
5.2 APPLICABLE WIRES
WIRE GAUGE
16 AWG
18-20 AWG
INSULATION DIAMETER
1.80-3.10 millimeters / .071-.122 inches
1.65-2.95 millimeters / .065-.116 inches
5.3 TEMPERATURE RATING
Mini-Fit Plus HCS has a field temperature of 65°C and field life rating for 10 years based on
testing per EIA-364-17B, Method A.
5.4 WAVE SOLDER PROCESS TEMPERATURE
Headers with molded pegs: 240°C MAX.
Headers without pegs: 265°C MAX
5.5 DURABILITY (MATING CYCLES)
Tin: 100 cycles
Gold: 250 cycles
Durability ratings established as tested per Durability Test Procedures described by EIA-364-09C
and meet requirements for low level contact resistance and DWV as prescribed per EIA-364-1000
Test Sequence Group 7.
REVISION:
C1
ECR/ECN INFORMATION: TITLE:
EC No: UCP2011-0141
DATE: 2010 /07/15
PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
5 of 13
DOCUMENT NUMBER:
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45750-001
BWIRKUS
BWIRKUS
APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC