30069-0611 Datasheet, PDF (2/2 Pages) Molex Electronics Ltd. – 4.20mm Pitch, Mini-Fit® TPA Header, Dual Row, Vertical, with PCB Mounting Flange, 6 Circuits, Tin (Sn) Over Nickel (Ni) Plating, without Drain Holes

Shrouded
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Electrical
Current - Maximum per Contact
Voltage - Maximum
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
Sales Drawing
Partial
No
No
-40°C to +105°C
Through Hole
13A
600V
5
Wave Capable (TH only)
1
235
PK-30069-001
PS-5556-003, RPS-30068-001
SD-30069-001
This document was generated on 08/07/2014
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION