15-80-0345 Datasheet, PDF (2/2 Pages) Molex Electronics Ltd. – 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

Termination Interface: Style
Electrical
Current - Maximum per Contact
Voltage - Maximum
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
Material Info
Old Part Number
Reference - Drawing Numbers
Product Specification
Sales Drawing
Through Hole
2.5A
250V
5
SMC & Wave Capable (TH only)
1
245
70567-0151
PS-70567
SDA-70567-****
This document was generated on 12/26/2013
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