0879141616 Datasheet, PDF (2/48 Pages) Molex Electronics Ltd. – 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

Shrouded
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Electrical
Current - Maximum per Contact
Voltage - Maximum
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
Sales Drawing
No
No
Yes
-55°C to +105°C
Through Hole
3A
250V
12
Wave Capable (TH only)
1
260
PK-89990-489
PS-87920-019
SD-87914-013
This document was generated on 05/25/2010
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