91803-0410 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – LaneLink™ 4x Latch Receptacle

FEATURES AND BENEFITS
5GHZ Bi-directional 4 Lane I/O Connector System with Superior
Mechanical Reliability
The Molex 4 Lane I/O connectors incorporate an industry compatible mating
interface compliant with InfiniBand^TM requirements. This I/O system has also
been adopted by several other standards or MSA groups in addition to
InfiniBand^TM , noted below. LaneLink^TM is a 100ohm cable to board I/O system
optimized for differential signaling at 2.5Gbps per pair. The Molex design
features superior mechanical reliability and an extensive range of options
including latching and jackscrews versions.
A new feature to both 4x options is the addition of a landing area for automated
Pick and Place.
Features
Benefits
• Die cast frame with unitary latch posts
and screw attach to PCB
• Provides the best available strain relief
of cable to socket and isolates cable
loads from SMT tails
• Optional top mount attach of die cast
frame to chassis
• Additional strain relief
• Dedicated pick and place landing area
• Solder post options (2 or 4 posts)
• Various place thickness accommodated
• High level of pin to PCB compliancy
• Extended crush PCB alignment posts
• Allows use of standard pick and place
nozzles
• Replaces need for screw down
• Helps coplanarity
• Eases alignment of connector to board
• Jackscrew option complies with SFF-8470
SPECIFICATIONS
Specifications
Reference Information
Packaging: Tray
Mates With: 91525 to 91635;
91629 to 91659
Designed In: Millimeters
Electrical
Voltage: 30V AC max
Current: 0.5A max
Contact Resistance: 80 mOhms
Dielectric Withstanding Voltage:
300V AC
Insulation Resistance: 1000
MOhms
Mechanical
Contact Retention to Housing: 5N
(1.12 lb) min
Mating Force: 55.5N (12.33 lb) max
for 4x; 73N ( 16.37 lb) max for 12x
Unmating Force: 7.0N (1.57 lb) min
for 4x; 10.5N (2.35 lb) min for 12x;
49.0N (10.99 lb) max for 4x; 59.0N
(13.23 lb) min for 12x
Durability: 250 cycles
Physical
Housing: LCP, UL 94V-0
Contact: Phosphor Bronze
Plating: Contact Area – Gold over
Palladium Nickel
Solder Tail Area – Tin/Lead
Underplating -- Nickel
PCB Thickness: 1.60mm (.063”),
2.40mm (.094”), 4.00mm (.157”)
Operating Temperature: -20 to 60
degrees Celsius
0.50mm (.020”) Pitch
LaneLink™ 4x Latch
Receptacle
91803 Jackscrew
Receptacle
91804 Latch Receptacle
Latch
Jackscrew