87715-9X00 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – PCI Express* connector

FEATURES AND SPECIFICATIONS
Molex offers the new PCI Express* revision 2 specs connectors in a through hole
configuration for high-bandwidth workstation and server applications
PCI Express is a third generation I/O architecture. PCI-SIG* recently revised the
PCI Express specifications from version 1.1 to version 2.0. This revision doubles
the PCI Express interconnect bit rate from 2.5 GT/s (gigatransfer per second) to
5 GT/s per lane. Unlike the previous version in which the PCI bus was
implemented via multi-drop parallel architecture, the PCI Express incorporates a
point-to-point signaling using differential pairs. A 16-lane link now could provide
approximately 16Gbps of data-transfer. With this increase in signaling speed,
the PCI Express now provides better support to high-bandwidth applications. It
is also backward compatible with current PCI Express 1.1 version products.
Molex’s through hole connector version of the PCI Express version 2.0 specs
provides customers design flexibility for a narrower interconnect links. This
would improve data-transfer at a lower cost.
All Molex PCI Express connectors are compliant with PCI-SIG* specifications. For
more information on these specifications please see www.pcisig.com
*PCI Express, ExpressModule, and PCI-SIG are trademarks of PCI-SIG
1.00mm (.039”) Pitch
PCI Express* connector
87715
Vertical, Through Hole
Features
• High-temperature thermoplastic housing
• Complies with PCI-SIG industry specifications
• Keying design allows only one mating orientation
• Hot Plugging
Benefits
• Withstands lead-free processing
• Allows connectors to support all PCI Express module cards
available in the market.
• Ensures correct mating of card module to edge card connector
• Allows for insertion and removal of card without system shut
down, facilitates connection in cramped spaces
SPECIFICATIONS
Reference Information
Packaging: Tray
UL File No.: TBD
CSA File No.: TBD
Mates With: PCI Express Card
Designed In: mm
Electrical
Voltage: 50 Volts AC (RMS)/DC
Current: 1.1A
Contact Resistance: 30 milliohms max
Dielectric Withstanding Voltage: 500V AC
Insulation Resistance: 1000 Megohms min
Mechanical
Max Terminal Retention Force: 5 N min/Terminal
Mating Force: 1.15 N max/contact pair
Unmating Force: 0.15 N min/contact pair
Durability: 50 Cycles
Physical
Housing: High Temperature Nylon, UL 94V-0
Contact: Copper Alloy
Plating:
Contact Area —0.76 µm Gold or 0.38 µm Gold
Solder Tail Area — Tin
Underplating — Nickel
Operating Temperature: - 55 ºC to +85 ºC