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86401 Datasheet, PDF (1/1 Pages) Molex Electronics Ltd. – FlexPlane™ Optical Circuitry
FEATURES AND SPECIFICATIONS
Features and Benefits
■ Diverse substrate size, shape and packaging
provides efficient and manageable solution to
high fiber count systems
■ Compatible with mass and discrete fiber
terminations ensuring a customized solution
■ Available in virtually any routing scheme
provides a variety of design alternatives
■ Direct or fusion splice terminations eliminate
additional insertion loss
■ Singlemode, multimode or hybrid versions
provide variety of options
Applications
■ Computing Equipment
■ Telecommunication Equipment
- Transmission
- Switching
- Multiplexing
■ Broadband Equipment
- Amplifiers
Reference Information
Telecordia GR-20 compliant
Use with: MT, MTP*, MPO, MT-RJ,
SMC, LC, FC, ST†, SC, MU, BMTP
and HBMTTM connector families
*MTP is a registered trademark of US Conec Ltd.
†ST is a trademark of Lucent Technologies
FlexPlane™
Optical Circuitry
86401
Molex’s FlexPlane optical flex circuit provides one of the highest density and versatile interconnect systems on the market today. For high fiber count
interconnects in backplanes and cross-connect systems, the FlexPlane’s high density routing on a flexible, flame-retardant substrate provides a manageable
means of fiber routing from card-to-card or shelf to shelf. A variety of interconnects including blind mating MT and MTP based connectors can be used to
connect the optical flex circuits to individual cards in a shelf.
Available in any routing scheme, fiber can be routed point-to-point, in a shuffle, or in a logical pattern. Direct or fusion-spliced terminations are available.
Non-fusion splice lead lengths are available up to two meters. Molex provides a variety of FlexPlane interconnect options including: MT, MTP, MPO, MT-RJ,
SMC, LC, FC, ST, SC, MU, up to 12 fiber Backplane MTP (BMTP) and up to 96 fiber High Density Backplane MT (HBMT).
Packaging alternatives include standard bare flexible substrate sandwiched in FR-4 or custom laminating. Each FlexPlane circuit can be fully tested down to
the per port insertion loss and return loss.
ORDERING INFORMATION
Order Number
86401-XXXX
Description
Contact Inside Sales for Ordering Information
Americas Headquarters
2222 Wellington Ct.
Lisle, Illinois 60532 USA
1-800-78MOLEX
amerinfo@molex.com
Order No. USA-186 Rev. 4
Far East North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
feninfo@molex.com
Far East South Headquarters
Jurong, Singapore
65-6-268-6868
fesinfo@molex.com
European Headquarters
Munich, Germany
49-89-413092-0
eurinfo@molex.com
Visit our Web site at http://www.molex.com/fiber
Printed in USA/0K/EL/2003.02
Corporate Headquarters
2222 Wellington Ct.
Lisle, Illinois 60532 USA
630-969-4550
©2003, Molex