78028-0008 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – PCI Express* Connectors

FEATURES AND SPECIFICATIONS
Molex’s PCI Express* connector offers greater signaling bandwidths for
today’s workstation and server applications
PCI Express is a third generation I/O architecture. PCI-SIG* recently
updated PCI Express specifications to greater signaling bandwidth. Unlike
the previous version in which the PCI bus is implemented via a multi-drop
parallel architecture, PCI Express now incorporates a point-to-point
signaling using differential pairs operating at 2.5 Gbps. PCI Express
provides adequate bandwidth to support developing I/O such as
Infiniband and 10G fiber channel.
Molex’s press fit version of PCI Express provides an alternative for
customers who require solderless termination on PCBs which have a high
layer count.
All Molex PCI Express connectors are compliant with PCI-SIG*
specifications. For more information on these specifications please see
www.pcisig.com
PCI Express* Connectors
78028
Vertical Press fit
Features and Benefits
ƒ High-temperature thermoplastic housing for lead-free processing
ƒ Keying design ensures correct mating of card module to edge card
connector
ƒ Press fit termination allows solderless termination on high layer
count PCBs
ƒ Complies with PCI-SIG industry specifications ensure connectors
support all PCI Express module cards available in the market
ƒ Ridge design will be compatible with module cards that require a
retention clip for secure retention
SPECIFICATIONS
Reference Information
Packaging: Tray
UL File No.: Pending
CSA File No.: Pending
Mates With : PCI Express^®* module card
Designed In: mm
Electrical
Voltage: 50 Volts AC (RMS)/DC
Current: 1.1 Amps/pin
Contact Resistance: 30 milliohms max
Dielectric Withstanding Voltage: 500V AC
Insulation Resistance: 1000 Megohms min
Mechanical
Max Terminal Retention Force: 2.94 N min/Terminal
Mating Force: 1.15 N max/contact pair
Un-Mating Force: 0.15 N min/contact pair
Durability: 50 Cycles
Physical
Housing: High Temperature Nylon, Black, UL 94V-0
Contact: Copper Alloy
Plating:
Contact Area —0.76 µm Gold or 0.38 µm Gold
Solder Tail Area — Tin
Underplating — Nickel
PCB Thickness: See Ordering Tables
Operating Temperature: - 55 ºC to +85 ºC
*PCI Express, ExpressModule, and PCI-SIG are trademarks of PIC-SIG