76001-0006 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – Parallel Board Spacing

FEATURES AND SPECIFICATIONS
Z-Power is a high-current, rigid, board-to-board and wire-to-board mezzanine style interconnect
designed to transfer power loads from one PCB to another
Z-Power connectors utilize a unique, dual interface
which results in long-term reliability. The Z-Power
connector allows 50.0A to be carried between parallel
boards in 0.232 in², with less than .020 milliohms
initial plane-to-plane resistance.
The Z-Power connector is press-fit into the PC base
board. The PC top board is then screwed down on top
of the Z-Power connector, forming a high-pressure
interface. A unique, dual Hertzian contact design
allows the screw to be installed without affecting the
compliant-pin interface in the opposing PCB.
The rigid nature of this interconnect allows high-density
PCB applications to benefit from real-estate savings, by
employing Z-Power in a dual role. Z-Power performs as
both a high-reliability power connector and a durable
stand-off, relieving the need for separate mechanical
stand-offs in some applications.
Z-Power can also be used as an efficient, wire-to-board
connector. This application is achieved through using
standard wire-crimp, ring-lug terminals as the mating
interface to the Z-Power screw-down terminal interface.
Z-Power™ Connector
10.30mm (.405”)
Parallel Board Spacing
Mezzanine, Board-to-Board
and Wire-to-Board
Applications
76001
Features and Benefits
n 50.0 and 30.0A versions available to cover a
variety of applications
n Low contact resistance is ideal for high-current
applications
n Compliant-pin interface provides a solderless
termination
n Rigid, screw-down interface ensures a high-
pressure, reliable contact
n Patented internal terminal design relieves stress on
press-fit pins from shock and vibration
n Captured internal nut provides for ease of assembly
n Board-to-board or wire-to-board interface provides
flexible design options
30.0 and 50.0A Z-Power Connectors
SPECIFICATIONS
Reference Information
Packaging: Tray
UL File No.: 1792321
Designed In: Millimeters
Electrical
Voltage: 600V
Current at 30°C
10 Circuit - 50.0A
6 Circuit – 30.0A
Contact Resistance:
Beginning of Life: 10 Circuit 0.18 milliohms max.
6 Circuit 0.30 milliohms max.
End of Life: 10 Circuit 0.25 milliohms max.
6 Circuit 0.40 milliohms max.
Insulation Resistance: 5000 Megohms min.
Mechanical
Insertion Force to PCB: 9.07N (20lbf) per tail
Recommended Torque: 0.75 N-m (6.6 Inch-lbs)
Durability: 5 cycles mate/un-mate (bolt interface)
Physical
Housing: LCP
Contact: Copper (Cu) Alloy
Plating:
Contact Area – 30m” min. Gold (Au)
or 100m” Tin (Sn) min.
Solder Tail Area – 100µ” min. Select Matte Tin (Sn)
Underplating – 50µ” min. Nickel (Ni)
PCB Thickness: 2.36mm (.093”) min.
Operating Temperature: -40 to +105°C