74642-1003 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – 6.25mm (.246”) Pitch Ganged RF

Ganged RF System Connects High Bandwidth RF
Signals In Blind-Mate Daughtercard Receptacles
and Backplane Headers
The Ganged RF system offers customers innovative
packaging with selectively loaded housings for
connecting up to 2.5GHz single-ended or analog RF
signals. The blind-mate right-angle daughtercard
receptacles and vertical backplane headers are
available in three- and four-port sizes with selective
loading of high-performance vertical signal pairs. The
press-fit terminals allow simple termination to the PCB
with optional application tooling available from Molex.
Options for cabling in both sizes are also available in
several standard lengths to connect with the right-angle
daughtercard receptacles.
Features and Benefits
s 50 Ohm ±10% matched impedance contact system
for low insertion loss and optimal signal integrity
s 60 db min. isolation to minimize crosstalk
s Press-fit termination and locator pegs promote easy
and reliable board termination
s Modular assembly of vertical signal pairs allow
custom loading
s High-temperature 94V-0 housings with generous
chamfers and blind-mating lead-ins for reliable and
consistent mating
s Contacts with 0.76µm (30µ”) min. gold plating on
mating surfaces for excellent reliability
6.25mm (.246”) Pitch
Ganged RF
74642, 74712
Right Angle Receptacle and
Vertical Header
SPECIFICATIONS
Reference Information
Packaging: Tray
UL File No.: E107635
CSA File No.: 152514 (LR19980)
Designed In: mm
Electrical
Voltage: 5.0 VAC
Current: 1.0 A max.
Contact Resistance: 35 milliohms max.
Dielectric Withstanding Voltage: 1000 VAC min.
Insulation Resistance: 1 Gigaohm min.
Return Loss:
0-1.0GHz: 15dB, 1.4:1 VSWR
1.0-2.5GHz: 12dB, 1.7:1 VSWR
Insertion Loss: 0.5dB max.
Physical
Housing and Insulator: 94V-0 high temperature thermoplastic
Terminals and Grounds: Tin Brass
Outer Ground Contact: Phosphor Bronze
Plating:
Terminals:
0.76µm (30µ”) min. Gold in contact area
0.88µm (35µ”) min. Tin/Lead selective
Grounds:
0.88µm (35µ”) min. Tin/Lead overall
Outer Ground Contact:
0.76µm (30µ”) min. Gold overall
Underplating: 1.27µm (50µ”) min. Nickel
PCB Thickness:
Daughtercard 3.2mm (.125”) max.
Backplane 4.5mm (.178”) max.
Operating Temperature: -45 to 85° C
Mechanical
Contact Insertion Force: 5.0N (1.1lb) max. per contact
Contact Retention to Housing: 5.0N (1.1lb) min. per module
Insertion Force to PCB: 50N (11.2lb) max. per terminal
Durability: 500 cycles