74552-0001 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – 1.85mm by 1.85mm (.073” by .073”) GbX* Cable Assembly

FEATURES AND SPECIFICATIONS
1.85mm by 1.85mm
(.073” by .073”)
GbX* Cable Assembly
GbX, the next-generation high-speed backplane interconnect cabling system, delivers over 6 Gbps
and signal density of 55 differential pairs per linear inch
The GbX high-performance backplane cable assemblies
and connectors provide the speed and density required
by leading-edge backplane designs. With a native
differential signaling speed of 6.0 Gbps, the system
is well suited for existing and future generations of
XAUI (10 Gigabit Attachment Unit Interface) and
InfiniBand^†- based systems.
74552 4-Pair Configuration
GbX cable assemblies offer improved capabilities to
current backplane cable products, with impedance
matching, low pair-to-pair crosstalk, within-pair and
pair-to-pair skew control and a variety of raw-cable
designs to meet customer-specific loss budgets. Cables
are available in a 4-pair (column) configuration.
GbX High Performance Cable Assemblies complement
Molex’s existing line of GbX products. For more
information on Molex’s extensive GbX product offering,
please visit: www.molex.com/ads/GbX.html.
Features and Benefits
Design
■ 4-pair configuration provides 55 real-differential
pairs per linear inch (2, 3 and 5 pair configurations
are possible extensions)^‡ allowing high density
with more differential pairs than similar backplane
products
■ Bifurcated contact beams assure greater reliability
with two points of contact to header pins
GbX Cable Assembly (left), Daughter Card Connector (right), Backplane Header (front)
Process
■ Opposed gap-resistance welding re-flows cable
conductor into the signal contact, providing a clean
electrical path
■ Integrated stiffeners and latches provide mechanical
robustness and solid mating to vertical or right-
angle mating (RAM) headers
■ Zinc or Aluminum die-cast backshells provide
shielding protection for custom Input/Output
backplane designs
■ Low-pressure, strain-relief insert molding provides
strain relief for the termination area and allows
tighter cable shield to conductor tolerances for
better impedance control
■ Ground shield for individual pairs reduces crosstalk
at the mating interface for improved system
performance
SPECIFICATIONS
Reference Information
Mates With:
GbX right-angle male connector (Series 75717)
GbX standard 4-pair header (Series 75235)
Designed In: Millimeters
Electrical
Current: 1.0A
Dielectric Withstanding Voltage: 250V
Insulation Resistance: 40 Megohms min.
*GbX is a registered trademark of Amphenol, Corp.
†InfiniBand is a registered trademark of the InfiniBand Trade Association
‡Contact Molex for tooling justification
Mechanical
Contact Insertion Force:
44.48N (10.00 lbf) typical per contact
Contact Retention to Housing:
8.90N (2.00 lbf) min. per contact
Insertion Force to PCB:
0.59N (0.13 lbf) max. per contact
Mating Force: 0.59N (0.13 lbf) max. per contact
Unmating Force: 0.29N (0.07 lbf) min. per contact
Durability: 250 cycles max.
Physical
Housing: LCP, UL 94V-0
Contact: Copper (Cu) Alloy
Plating:
Contact Area — 0.76 um (30u”) Gold (Au) min.
Solder Tail Area — Tin (Sn)
Underplating — Nickel (Ni)
PCB Thickness: 1.60mm (.062”) typical
Operating Temperature: -55 to +105°C
GbX 4-Pair Wafer – Signal View