74506 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – 0.50mm (.020”) Pitch LaneLink™ 4x and 12x Cable Assemblies

LaneLink™ assemblies feature user friendly squeeze-to-release latch to
guarantee proper mating
LaneLink cable assemblies meet the new InfiniBand* architecture, which is an approach to I/O technology
that was created by the industry’s top computer manufacturers to address the need for greater scalability,
reliability, availability and performance in and around servers. The technology will be used to connect servers
with remote storage and networking devices, as well as other servers, through host-channel adapters (HCAs)
and target-channel adapters (TCAs).
The InfiniBand specification grew out of the merger of two earlier groups, Next-Generation I/O and Future
I/O, to become one of the enablers for industry-standard server networks. It is designed to support
bandwidths well beyond today’s prevailing I/O technologies and will run at 2.5Gbps in a single-directional
link. Scaling in bandwidth and frequency is achieved in links of 1 bit, 4 bit and 12 bit bidirectional connections
(1X, 4X and 12X). The Molex design adds desirable features, solving issues existing with competitive product.
This I/O system has been adapted by several other standards or MSA groups in addition to InfiniBand.
*InfiniBand is a registered trademark of the InfiniBand Trade Association
0.50mm (.020”) Pitch
LaneLink™ 4x and 12x Cable
Assemblies
4x – 74506
12x – 74509
Features and Benefits
s Squeeze-to-release latch provides user with friendly, positive latch/
unlatch from the PCB connector
s Molex offers a total InfiniBand solution that provides an industry
standard compatible interface with 4x (91525) and 12x (91629)
connectors
s Lengths up to 20m are possible with equalization and pre-emphasis
(10m standard InfiniBand)
s Greater system flexibility is available with either latch or jackscrew
connector and plug designs
s High performance production test rack provides 100% testing to
XAUI and InfiniBand industry standards
s Standard 4x interface mates with XenPak (74734) and XPAK
(74732) copper transceivers
SPECIFICATIONS
Reference Information
Mates With: 91525-XXXX (latch)
91629-XXXX (jackscrew)
Designed In: Millimeters
Electrical
Voltage: 30V AC/contact
Current: 0.5A/contact
Contact Resistance: 80ohms
Dielectric Withstanding Voltage: 300V/min DC
Insulation Resistance: 10³ M Ohms minimum between
adjacent contacts
Mechanical
Mating Force: 55.5N
Unmating Force: 49.0N
Durability: 250 cycles
Physical
Housing: Zinc die cast
Contact: Gold flash over Nickel plating
Plating: Contact Area --Nickel
Solder Tail Area –Nickel allover
Underplating – Gold flash over
Paladium Nickel
Operating Temperature: -20 + 85°C