74191-0002 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – High Speed Edgecard Connector in Ground Signal Format for High Performance Applications

FEATURES AND BENEFITS
The HiSpecGS connector features Molex’s patented Ground by
Design™ contact system with two mating levels: longer power/
ground contacts and shorter high speed signal contacts. This
innovative design offers low insertion force, a shorter signal
electrical path, lower inductance and speeds over 400MHz.
Molex’s HiSpecGS connector features a 0.76mm (.030”) pitch
with 32 high speed signals and 34 power/ground contacts per
linear inch, enabling its fast edge rate, low cross talk and high
performance capabilities. The 330-circuit HiSpecGS connector is
used in the Alpha Slot B 21264 processor for WTX platform work
stations. Molex and Alpha Processor, Inc., the maker of the Alpha
21264 processor, worked together to develop this interconnect. The
108-circuit and 242-circuit HiSpecGS connectors will be used as the
Memory Expansion Card Connector (MECC) for Rambus- based
memory cards. The 108-circuit connector is for single channel
Rambus applications; the 242-circuit connector is for dual channel
Rambus applications.
The Molex HiSpecGS connector series provides exceptional price
performance value in a high-density package.
HiSpecGS^™
High Speed Edgecard
Connector in Ground Signal
Format for High Performance
Applications