71743-4040 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – 1.27mm (.050”) Pitch EBBI™ 50D Receptacles

FEATURES AND SPECIFICATIONS
Surface Mount SCA-2 Receptacles Maximize
Board Space For Higher Density Requirements
Compared to Through-Hole Versions
Molex’s SCA-2 Surface Mount Technology (SMT)
receptacles feature surface mount leads, designed to
increase usable board space beneath the connector.
Double-sided boards can be used as a result of SMT
versus through-hole leads, providing increased density.
The SMT receptacles are available in 40 and 80 circuit
versions, commonly found in Fibre Channel and other
drive configurations for storage applications.
SCA-2 SMT receptacles include all of the features
found in Molex’s standard range of SCA-2 products.
SCA-2 connectors meet the requirements of the SCA-2
Single Connector Attach specification for small form
factor disk drives. For additional information on this
specification, visit: www.scsita.org.
1.27mm (.050”) Pitch
EBBI™ 50D Receptacles
71743 SCA-2, SMT, Vertical
Features and Benefits
■ High-temperature thermoplastic housing withstands
lead-free processing temperatures
■ First-mate, last-break terminals allow hot plugging
■ Lead-free plating meets RoHS requirements
■ Can be mated to .062” boards and used as a card-
edge connector to provide a lower cost board-to-
board alternative
Left: 80 circuit version Right: 40 circuit version
■ Integral guide ears with ESD grounding clips provide
blind-mate capability
■ 40 and 80 circuit versions accommodate Fibre
Channel, SCSI and other drives
■ Leaf style contact with 30u” Gold (Au) plating rated
for over 500 mating cycles
SPECIFICATIONS
Reference Information
Packaging: Tube
UL File No.: E29179
CSA File No.: LR19980-239A
Mates With: Standard SCA-2 and EBBI plugs (Series
71661, 87012, 87571, 87572)
Designed In: Inches
Electrical
Voltage: 30V
Current: 1.0A
Contact Resistance: 20 milliohms max.
Dielectric Withstanding Voltage: 500V AC
Insulation Resistance: 1000 Megohms min.
Mechanical
Contact Retention to Housing: 500g min.
Mating Force: 90g max.
Unmating Force: 15g min.
Normal Force: 90g
Durability: 500 cycles min.
Physical
Housing: LCP UL 94V-0
Contact: Copper (Cu) Alloy
Retention Clip: Copper (Cu) Alloy
Plating:
Contact Area — 30µ” Select Gold (Au)
Solder Tail Area — Tin (Sn)
Underplating — Nickel (Ni)
Operating Temperature: -40 to + 105°C
Side view shows first-mate, last-break contacts,
board retention clip and locating peg