48212-0100 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – DDR / DDR 2 SODIMM Connectors

FEATURES AND SPECIFICATIONS
Molex’s offers the complete range of SODIMM sockets solutions for the
Notebook PC markets
The demand for faster performing notebook PC has provided a major
challenge to notebook PC system designers. High speed and long battery life
becomes a must for power user on the road. To deliver a product that is both
fast and efficient in power management, one of the few key considerations
is the power consumption of the memory module/socket.
The 200 circuits DDR/DDR2 SODIMM socket provides such a solution for
notebook PC designers. Due to its’ small form factor, it enables notebook PC
designer to use smaller chassis. This allows for the development of smaller
and lighter notebook PC. Though both the DDR (2.5 volt) and DDR2 (1.8
volt) version of the SODIMM socket are almost identical, the differentiating
factor is the location of the voltage key. This prevents the wrong type of
memory module from mating with the socket. DDR2 is the next-generation
DDR memory technology. It is faster, higher bandwidth, lower power
consumption and better thermal management.
Molex is an active member of JEDEC work group which defines standards for
the memory industry. The DDR/DDR2 SODIMM Socket accepts modules that
meet the JEDEC MO-224 outline. It comes in Lead Free plating and is RoHS
compliant.
0.60mm (.024”) Pitch
DDR / DDR 2 SODIMM
Connectors
48212
Reverse Mount
48213
Standard Mount
Features
Benefits
• Low profile
• Provide 4.0mm & 5.2mm Height
• Standard & Reverse version
• Flexible of PCB layout design
• Plastic latches with metal support
• User will not over bend the latch when they released
constrain movements of the plastic latches module
• High Temperature Thermoplastic housing • Capable of lead free solder processing temperatures
• Tape & Reel packing
• For customer auto pick & place assembly process.
SPECIIFICATIONS
Reference Information
Packaging: Embossed Tape & Reel
UL File No.:
CSA File No.:
Mates With: JEDEC Standard Memory Modules
Designed In: mm
Electrical
Voltage: 50 AC
Current: 0.50A.
Contact Resistance: 30 milliohms max.
Dielectric Withstanding Voltage: 200V AC
Insulation Resistance: 100 Megohms min.
Mechanical
Contact retention force: 2.45N (0.55 lb)
Durability: 30 cycles
Physical
Housing: Liquid Crystal Polymer, Glass-filled)
Contact: Phosphor Bronze (CuSN)
Plating:
Contact Area — 0.13μm (5 μ”) Gold (Au)
Solder Tail Area — Gold (Au) Flash.
Underplating — Nickel (Ni)
PCB Thickness: 1.6mm
Operating Temperature: -40°C to 85 °C