47457-8001 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – miniSD Memory Card Connector

FEATURES AND SPECIFICATIONS
Molex offers 2 more miniSD card connector to its existing range
Small and compact, the miniSD connector is about 30% smaller than the
original Secure Digital (SD*) connector. This reduction in size allows the
design of smaller applications with SD architecture interface. The miniSD card
is backward compatible with the SD connector via a card an adaptor which
provides user the flexibility of having a miniSD card for both SD and miniSD
applications.
Some of the design features include molded spring for strong card retention,
effective metal shielding against EMI, RFI and ESD. A detect switch is
deployed to ensure the connectivity of card to connector. The push-push
feature aids user in inserting and extracting the card.
Molex miniSD card connector comes in standard and reverse mount versions.
Please refer to Molex's Website and the Miniature Memory Card Catalog
available in Literature Central for Molex's full range of miniSD connectors.
Features
• Card detect switch
• Read/Write protection switch
• Low profile, compact size
• Metal shield
• Solder tabs
• Beveled spring terminal design
Benefits
• Confirms card presence
• Provides protection of content in the SD
Card
• Space savings
• EMI/RFI and ESD protection
• Strong retention of connector to PCB
• Secure mating of card to connector
1.30mm (.051") Pitch miniSD
Memory Card Connector
47457
Top Mount
Push-push
SMT
48050
Bottom Mount
Push-Push
SMT
*miniSD and SD is a registered trademark of Secure Digital Association
SPECIIFICATIONS
Reference Information
Packaging: Embossed Tape on Reel
UL File No.:
CSA File No.:
Uses With: miniSD memory card
Designed In: mm
Electrical
Current: 0.5A
Voltage: 10V max
Contact Resistance: 40 milliohms max.
Dielectric Withstanding Voltage: 500V AC
Insulation Resistance: 1000 milliohms min
Mechanical
Insertion Force: 5±1.5 N (0.51±0.15 kgf)
Unmating Force: 5±1.5 N (0.51±0.15
kgf)
Durability: 10,000 cycles
Physical
Housing: Thermoplastic, High
Temperature,
UL 94V-0
Contact: Copper (Cu) Alloy
Plating:
Contact Area — Gold (Au)
Solder Tail Area — Tin (Sn)
Underplating — Nickel (Ni)
PCB Thickness: 1.2mm (.045")
Operating Temperature: -25°C to +90°C