47019-1502 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – SIM Card Connector Block Type

FEATURES AND SPECIFICATIONS
Molex offers the SIM and Mega-SIM block type card connectors for mobile phone markets
Molex offers its range of Subscriber Identification Module Card connectors for the Mobile
Communications Industry. The GSM (Global System for Mobile Communications) standard call
for a Subscriber Identification Module or SIM card which is used for billings, security and
number storage purposes. The SIM card parameters are defined by ISO GSM SIM Card
standards.
While the card is standardized, the differences in phone designs do not allow standard
connectors. Molex in, close collaboration with its customer has developed a range of SIM card
connectors that feature a range of standard options plus the ability to custom design parts in
specific applications.
This release covers the block-type SIM connector. In this design, the SIM card is integrated
into the equipment. It comes in 6 and 8 circuit options. The 6 circuit version is most commonly
used. The 8 circuit version, which is also known as a Mega-SIM connector, has 2 additional
circuits more that than the 6 circuits version. These additional 2 circuits are reserved for
memory expansion in the hardware.
For more information about the SIM connector family, please visit:
http://www.molex.com/product/memory/simcard.html
2.54mm (.100") Pitch
SIM Card Connector
Block Type
47019 6-Circuit SIM Header
47494 8-Circuit Mega-SIM Header
Features
„ High-temperature thermoplastic housing
„ Smooth edges around contact
„ Round contact design
SPECIIFICATIONS
Reference Information
Packaging: Embossed Tape on Reel
UL File No.: TBD
CSA File No.: TBD
Use With: SIM Cards
Designed In: mm
Electrical
Voltage (max.): 15V
Current (max.): 0.500 Amp
Shielded: No
Benefits
„ Withstands lead-free processing
„ Prevent damaging of SIM card
„ Allows good contact between card and connector
Physical
Housing: LCP. G/F, UL 94V-0, Black
Contact: Phosphor Bronze
Plating:
Contact Area — 0.8µm (30 µ”) Gold (Au)
Solder Tail Area — 0.05µm Gold (Au)
Underplating — 2.00µm (78µ”) Nickel (Ni)