45802-0311 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – HD Mezz™ Connectors

FEATURES AND SPECIFICATIONS
Simplify PCB routing, maximize card-slot space and achieve speeds up to 12.5 Gbps with Molex’s
HD Mezz; designed for the large and growing high-density and high-performance mezzanine
connector market
The High Density Mezzanine (HD Mezz) board-to-
board connector is designed for computer, networking,
telecommunications, storage and general market
applications with high pin-count devices on mezzanine
or module printed circuit boards (PCBs). This design
provides a flexible tooling approach that allows for
multiple stack heights and circuit-size extensions.
HD Mezz provides many benefits. It allows
customers to simplify PCB routing without sacrificing
performance, avoid the expense of large complex
multi-layer boards and utilize space more efficiently
within a given card slot area. Option cards may be
added or upgraded to increase flexibility in design,
production and testing.
The HD Mezz design has superior electrical and
mechanical features that are cost competitive. The
Molex patented solder-charge technology results in
better process yields and a lower applied cost versus
equivalent BGA connector products.
1.20 by 2.00mm
(.047 by .079”) Pitch
HD Mezz™ Connectors
45802 HD Mezz™ Receptacle
45830 HD Mezz™ Plug
Features and Benefits
n Molex’s patented solder attach method is more cost
effective and reliable than Ball Grid Array (BGA)
connector attach methods
n Data rates up to 12.5 Gbps for excellent signal
clarity with ample bandwidth for customer
requirements in high-speed designs
n Stack heights ranging from 16.00 to 38.00mm
(.630 to 1.496”) and circuit sizes of 91 to
403 circuits provides ease in design based on
engineering constraints in system envelopes
n Highest contact density on the market with 14
differential pairs per cm² is extremely useful for
space constrained designs with limited PCB real
estate
n Reliable mating interface with 2.00mm (.079”)
wipe and two points of contact with sufficient
conductive wipe for clean signal transmission and
enhanced durability
Left to right: HD Mezz Receptacle (Series 45802) and
HD Mezz Plug (Series 45830)
SPECIFICATIONS
Reference Information
Product Specification: PS-45802-001
Packaging: Tray
UL File No.: TBD
CSA File No.: TBD
Designed in: Millimeters
Electrical
Voltage: 250V AC per contact
Current: 2.0A per contact
Contact Resistance: 25 milliohms nominal
Dielectric Withstanding Voltage: 500V DC
Insulation Resistance:
Across Wafers – 5000 Megohms min.
Within Wafers – 1000 Megohms min.
Mechanical
Mating Force: 51g nominal per contact
Unmating Force: 25g nominal per contact
Normal Force: 51g nominal per contact
Durability: 100 cycles
Physical
Housing: Glass-filled LCP, UL 94V-0
Contact: Copper (Cu) alloy
Plating: Contact Area – 0.75µm Gold (Au) min.
Solder Tail Area – 2.50µm Tin (Sn) min.*
Underplating – 1.25µm Nickel (Ni) overall
Operating Temperature: -55 to +105°C
*Please contact Molex Customer Service for lead-free solder tail plating options