44914-0201 Datasheet, PDF (1/2 Pages) Molex Electronics Ltd. – 3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers

FEATURES AND SPECIFICATIONS
Micro-Fit 3.0 Family Offers Press-Fit Headers For High-Density
Power and Signal Applications
The Micro-Fit 3.0, CPI (Compliant Pin Interface) and Micro-Fit 3.0, BMI CPI
(Blind-Mate version with Compliant Pin Interface) are vertical header product
extensions featuring press-fit PC tails. These headers are designed for high-
density applications where press-fit terminations are required. The CPI products
are appropriate for both power and signal uses as they can carry up to 5.0A of
current per circuit.
The standard Micro-Fit 3.0, CPI headers incorporate a compact housing that
mates with standard wire-mount housings and crimp terminals for wire-to-board
applications.
The Micro-Fit 3.0, BMI CPI headers feature a funnel entry to guide the mating
receptacle into place. Micro-Fit 3.0, BMI headers mate exclusively with BMI
components, which include panel-mount receptacles with crimp terminals and
PCB receptacles for wire-to-board and board-to-board applications.
Features and Benefits
■ CPI style (press-fit) pins require no soldering to the PCB
■ Designed for multiple board thicknesses of 2.36mm (.093”) or greater
■ Dual-row vertical headers available in 2-24 circuits for the standard version
and 4-24 circuits for the BMI (blind-mate) version
■ Rated up to 5.0A of current for both power and signal applications in wire-to-
board and board-to-board configurations
■ Fully polarized with positive locks for proper mating
■ Fully isolated contacts for electrical and mechanical integrity
3.00mm (.118”) Pitch
Micro-Fit 3.0, CPI™
Micro-Fit 3.0, BMI™ CPI
Vertical Headers
Reference Information
Packaging:Tray
UL File No.: E29179
CSA File No.: LR19980
TUV No.: R95107
Designed In: Millimeters
Electrical
Voltage: 250V
Current: 5.0A
Contact Resistance: 10 milliohms max.
Dielectric Withstanding Voltage: 1500 VAC
Insulation Resistance: 1000 Megohms min.
Mechanical
Insertion Force to PCB: 35.6N (8.0lb) per circuit max.
Retention Force to PCB: 106.8N (24.0lb) per circuit min.
Mating Force: 8.0N (1.8lb) per circuit max.
Unmating Force: 3.6N (0.8lb) per circuit min.
Durability: 30 cycles
Physical
Housing: High-temperature polymer, UL 94V-0
Contact: Brass alloy
Plating:
Contact area – 5.1µm (200µ") min. Tin, 0.38µm (15µ”)
min. select Gold or 0.76µm (30µ”) min. select Gold
PC tails – Tin/Lead
Underplating: Nickel
PCB Thickness: 2.36mm (.093”) min.
Operating Temperature: -40 to +105° C