WC26SM_12 Datasheet, PDF (2/2 Pages) MMD Components – WC26SM Series Crystal

Mechanical Details
4.05 [.159]
1.90 [.075] ^CL
3.25 [.128]
CL
6.50 [.256] MAX
2.00 [.079]
3.80 [.150]
2.54 [.100]
2.00 [.079]
3.30 [.130] MAX
GLUE PAD
3.40 [.134]
1.70 [.067]
1.00 [.039]
1.70 [.067]
1.70 [.067]
SUGGESTED PAD LAYOUT
0.25 [.010]
0.25 [.010]
DIMENSIONS IN BRACKETS ARE IN INCHES
2.95 [.116]
0.25 [.010]
2.30 [.091]
NOTES
1. CAN PLATING = Ni
2. LEAD PLATING = Sn 95% - 98%, Cu 2% - 5%
Tape & Reel
PITCH
TAPE
REEL DIA
PITCH
TAPE
REEL
COUNT
8.0
16.0
330 [13 IN]
1000
NOTES: UNLESS OTHERWISE SPECIFIED
1. Applicable Standards / Specifications
ANSI Y14.5M, Dimensions and Tolerances
EIA-481-B, 8 mm through 200mm Embossed Carrier Taping and 8 mm and 12 mm
Punched Carrier Taping of Surface Mount Components for Automatic Handling.
2. Dimensions are in millimeters.
3. Tolerances are ±0.1 mm unless otherwise specified.
4. Do not scale drawing.
DIRECTION OF FEED
MMD Monitor/Quartztek
30400 Esperanza, Rancho Santa Margarita, CA, 92688
Phone: [phone], Fax: [phone], www.mmdcomp.com
[e-mail]
Specifications are subject to change without notice.
Revision:
WC26SM082812G
Pg 2 of 2