MTTBS3 Datasheet, PDF (1/2 Pages) MMD Components – Low Profile SMD Device

MTTB Series – 5 X 3.2 Ceramic SMD VCTCXO
 Low Profile SMD Device
 Hermetically Sealed
 Tight Stability Over Temperature
 Low Power Consumption
Frequency Range
10.000MHZ to 32.000MHZ
Frequency Stability vs Temperature*
(See Frequency Stability vs Temperature Table)
Frequency vs Time
±1 ppm per year
Operating Temperature Range
(See Frequency Stability vs Temperature Table)
Storage Temperature Range
-40°C to +85°C
Supply Voltage (±10%)
+2.6 VDC to +2.8VDC +3.0 VDC to +3.3VDC +2.6 VDC to +2.8VDC +3.0 VDC to +3.3VDC
Control Voltage
Vc = +1.40VDC
+0.40VDC to
+2.40VDC
Vc = +1.50VDC
+0.50VDC to
+2.80VDC
Vc = +1.40VDC
+0.40VDC to
+2.40VDC
Vc = +1.50VDC
+0.50VDC to
+2.80VDC
Supply Current
1.5mA max
5mA max
Output Type
Clipped Sinewave
HCMOS
Output Level
0.9 – 1.4 Vp-p
Logic “1” = 90% of Vdd Min
Logic “0” = 10% of Vdd Max
Load
10k Ohms // 10pF
15pF
Harmonics
-10dBc max
Frequency Tunning Range
±3 ppm to ±25 ppm
Phase Noise
-135dBc/Hz max (at 1kHz offset)
Start-up Time
2ms max (Output level will be 90% from the final value)
* Inclusive of Temperature., Load, and Voltage
Environmental & Mechanical Detail
Shock
Solderability
Solvent Resistance
Vibration
Gross Leak Test
Fine Leak Test
MSL
Phase Noise
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2003
MIL-STD-883, Method 215
MIL-STD-883, Method 2007, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A-2
Level 1 per IPC/JEDEC J-STD 20
Marking Detail
Line 1 = MXXXXX
M = MMD
XXXXX = Frequency in MHZ
Line 2 = SYYWWL
S = Internal Code
YYWW
= 4 Digit Date Code
(Year / Week)
L = Denotes RoHS Compliant
Line 3 = XXXXX
Internal use only
May vary with lots
Black dot to denote Pin 1
MMD Monitor/Quartztek
30400 Esperanza, Rancho Santa Margarita, CA, 92688
Phone: [phone], Fax: [phone], www.mmdcomp.com
[e-mail]
Revisions only with customer approval
Revision:
MTTB121120J
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