SEF-A1F1 Datasheet, PDF (2/2 Pages) Mitsumi Electronics, Corp. – Solid Optical Fingerprint Sensor

MITSUMI
Solid Optical Fingerprint Sensor
SPECIFICATIONS
Item
Specification
Fingerprint detection method
Sweep-type interdigital scattered light method
Structure
Single-unit mold including light-source LEDs
Pixels
600dpi-256 pixels/line
Sweep speed
10cm/sec
Temperature range
Storage: -20 to +80°C, Operation:-5 to +70°C
Electrostatic discharge resistance
20kV or greater
Power source voltage
5.0±0.5V
Consumption current
35mA typ.
Dimensions
18.2 (W) 4.8 (D) 2.8 (H) mm (not including flange)
*^{Specifications may be changed for the purpose of improvement and upgrading.}
DIMENSIONS
PIN No.
1
13
8.2 ^±1
FPC
Light Lead Block
Finger Sweep Center
Mold
Image Guide
PWB
Unit: mm