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PM200CSE060 Datasheet, PDF (6/6 Pages) Mitsubishi Electric Semiconductor – FLAT-BASE TYPE INSULATED PACKAGE
MITSUBISHI <INTELLIGENT POWER MODULES>
PM200CSE060
FLAT-BASE TYPE
INSULATED PACKAGE
¡
VD
IF
VD
VD
¡
IF
20k ≥10µ
VUP1
≥0.1µ
UP
VUPC
VVP1
VP
VVPC
VWP1
WP
VWPC
20k
≥10µ
UN
≥0.1µ
20k
¡
≥10µ
IF
VN
≥0.1µ
20k
VN1
¡
≥10µ
VD
IF
WN
≥0.1µ
VNC
Vcc
OUT
Si
In
GND GND
Vcc
OUT
Si
In
GND GND
Vcc
OUT
Si
In
GND GND
Vcc OUT
Fo
Si
In
GND GND
TEMP
Th
Vcc OUT
Fo
Si
In
GND GND
Vcc
Fo OUT
Si
In
GND GND
P
+
–
U
V
M
W
N
NC
5V 1k
NC
Fo Rfo
: Interface which is the same as the U-phase
Fig. 8 Application Example Circuit
NOTES FOR STABLE AND SAFE OPERATION ;
•Design the PCB pattern to minimize wiring length between opto-coupler and IPM’s input terminal, and also to minimize the
stray capacity between the input and output wirings of opto-coupler.
•Quick opto-couplers: TPLH, TPLH ≤ 0.8µs. Use High CMR type. The line between opto-coupler and intelligent module
should be shortened as much as possible to minimize the floating capacitance.
•Slow switching opto-coupler: recommend to use at CTR = 100 ~ 200%, Input current = 8 ~ 10mA, to work in active.
•Use 4 isolated control power supplies (VD). Also, care should be taken to minimize the instantaneous voltage charge of the
power supply.
•Make inductance of DC bus line as small as possible, and minimize surge voltage using snubber capacitor between P and N
terminal.
•Use line noise filter capacitor (ex. 4.7nF) between each input AC line and ground to reject common-mode noise from AC line
and improve noise immunity of the system.
Sep. 2001