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CM150DY-34A Datasheet, PDF (4/5 Pages) Mitsubishi Electric Semiconductor – HIGH POWER SWITCHING USE
HALF-BRIDGE
SWITCHING CHARACTERISTICS
SWITCHING TIME vs. COLLECTOR CURRENT
103 td(off)
7 tf
5
3 td(on)
2
102
7
5 tr
3
2
101
101 2 3
5 7 102
Conditions:
VCC = 1000V
VGE = ±15V
RG = 3.2Ω
Tj = 125°C
Inductive load
2 3 5 7 103
COLLECTOR CURRENT IC (A)
SWITCHING LOSS vs.
COLLECTOR CURRENT
102
7
Eon
5
Eoff
Err
3
2
101
7
5
3
2
1010 01
23
5 7 102
Conditions:
VCC = 1000V
VGE = ±15V
RG = 3.2Ω
Tj = 125°C
Inductive load
2 3 5 7 103
COLLECTOR CURRENT IC (A)
REVERSE RECOVERY CHARACTERISTICS
OF FREE-WHEEL DIODE
103
7
5
3
2
102
7
5
3
2
101101
23
trr
Irr
5 7 102
Conditions:
VCC = 1000V
VGE = ±15V
RG = 3.2Ω
Tj = 25°C
Inductive load
2 3 5 7 103
EMITTER CURRENT IC (A)
4
MITSUBISHI IGBT MODULES
CM150DY-34A
HIGH POWER SWITCHING USE
HALF-BRIDGE
SWITCHING CHARACTERISTICS
SWITCHING TIME vs. GATE RESISTANCE
104
Conditions:
7 VCC = 1000V
5 VGE = ±15V
3 IC = 150A
Tj = 125°C
2 Inductive load
td(off)
103
td(on)
7
5
tr
tf
3
2
1012 00 2 3 5 7 101 2 3 5 7 102
GATE RESISTANCE RG (Ω)
SWITCHING LOSS vs.
GATE RESISTANCE
103
Conditions:
7 VCC = 1000V
5 VGE = ±15V
3 IC = 150A
Tj = 125°C
2 Inductive load
Eon
102
7
5
Eoff
3
Err
2
1011 00 2 3 5 7 101 2 3 5 7 102
GATE RESISTANCE RG (Ω)
100
7
5
3
2
10–1
7
5
3
2
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(IGBT part & FWDi part)
Single Pulse
Tc= 25°C
Tc measured point is
just under the chips
10–2
7
5 IGBT part:
3 Per unit base = Rth(j–c) = 0.078°C/W
2 FWDi part:
Per unit base = Rth(j–c) = 0.15°C/ W
10–3
10–52 3 5710–42 3 5710–32 3 5710–22 3 5710–12 3 57100 2 3 57101
TIME (s)
Jun. 2007