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CM450DX-24A Datasheet, PDF (3/7 Pages) Mitsubishi Electric Semiconductor – IGBT MODULES HIGH POWER SWITCHING USE | |||
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MITSUBISHI IGBT MODULES
CM450DX-24A
HIGH POWER SWITCHING USE
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
INVERTER PART
Symbol
Parameter
Conditions
ICES
VGE(th)
IGES
Collector cutoff current
VCE = VCES, VGE = 0V
Gate-emitter threshold voltage IC = 45mA, VCE = 10V
Gate leakage current
±VGE = VGES, VCE = 0V
VCE(sat)
IC = 450A, VGE = 15V
Collector-emitter saturation voltage
(Note. 6)
IC = 450A, VGE = 15V
Cies
Coes
Cres
Input capacitance
Output capacitance
Reverse transfer capacitance
VCE = 10V
VGE = 0V
QG
Total gate charge
VCC = 600V, IC = 450A, VGE = 15V
td(on)
Turn-on delay time
VCC = 600V, IC = 450A
tr
Turn-on rise time
VGE = ±15V, RG = 0.68â¦
td(off)
Turn-off delay time
Inductive load
tf
Turn-off fall time
trr (Note.3) Reverse recovery time
Qrr (Note.3) Reverse recovery charge
(IE = 450A)
VEC(Note.3) Emitter-collector voltage
IE = 450A, VGE = 0V
IE = 450A, VGE = 0V, chip
Rlead
Module lead resistance
Main terminals-chip, per switch
Rth(j-c)Q Thermal resistance
per IGBT
Rth(j-c)R (Junction to case) (Note. 1) per free wheeling diode
Rth(c-f)
Contact thermal resistance Thermal grease applied
(Case to heat sink) (Note. 1) per 1 module
RGint
Internal gate resistance
per switch
RG
External gate resistance
Tj = 25°C
Tj = 125°C
Chip
(Note. 6)
(Note. 2)
TC = 25°C
TC = 125°C
Min.
â
6
â
â
â
â
â
â
â
â
â
â
â
â
â
â
â
â
â
â
â
â
1.4
2.8
0.68
Limits
Typ.
Max. Unit
â
1
mA
7
8
V
â
0.5
µA
2.0
2.6
2.2
â
V
1.9
â
â
68
â
5.9
nF
â
1.4
2000
â
nC
â
650
â
250
â
700
ns
â
600
â
250
14
â
µC
2.6
3.4
V
2.5
â
0.8
â
mâ¦
â
0.044
â
0.078 K/W
0.015
â
2.0
2.6
3.0
5.2
â¦
â
6.8
NTC THERMISTOR PART
Symbol
Parameter
R
âR/R
B(25/50)
P25
Zero power resistance
Deviation of resistance
B constant
Power dissipation
Conditions
TC = 25°C
TC = 100°C, R100 = 493â¦
Approximate by equation
TC = 25°C
Min.
4.85
â7.3
(Note. 7) â
â
Limits
Typ.
5.00
â
3375
â
Max.
5.15
+7.8
â
10
Note.1: Case temperature (TC), heat sink temperature (Tf) measured point is just under the chips. (Refer to the figure of the chip location.)
2: Typical value is measured by using thermally conductive grease of λ = 0.9W/(m·K).
3: Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi).
4: Pulse width and repetition rate should be such that the device junction temperature (Tj) dose not exceed Tjmax rating.
5: Junction temperature (Tj) should not increase beyond 150°C.
6: Pulse width and repetition rate should be such as to cause negligible temperature rise.
(Refer to the figure of the test circuit for VCE(sat) and VEC)
7: B(25/50) = In( R25 )/( 1
R50 T25
1)
T50
R25: resistance at absolute temperature T25 [K]; T25 = 25 [°C]+273.15 = 298.15 [K]
R50: resistance at absolute temperature T50 [K]; T50 = 50 [°C]+273.15 = 323.15 [K]
Unit
kâ¦
%
K
mW
Jul. 2009
3
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