MGFS38E2325-01 Datasheet, PDF (19/21 Pages) Mitsubishi Electric Semiconductor – 2.3 - 2.5GHz HBT MMIC MODULE

Specifications are subject to change without notice.
EXAMPLE METAL LAND PATTERN
Mitsubishi Semiconductors
MGFS38E2325-01
2.3 - 2.5GHz HBT MMIC MODULE
Note:
UNIT : mm
Through holes with 200um diameter should be put with a distance of 500um among them.
It is recommended that they have metallization of 25um thick on the inside wall.
MITSUBISHI ELECTRIC CORPORATION
(19/21)
Rev. 1.1
Sep. -2010