MF-27WXC Datasheet, PDF (14/15 Pages) Mitsubishi Electric Semiconductor – 2.5Gbps SFP TRANSCEIVER MODULE

MITSUBISHI (OPTICAL DEVICES)
MF-27WXC Series
2.5Gbps SFP TRANSCEIVER MODULE
17. Packing
Ten SFPs are packed up in this packing box.
Dust Cap
Presses Plate
SFP
Packing box
- Capacity: 10pcs. / box
- Packing box and Presses Plate material:
Cardboard with ESD protection coat.
This product is sensitive to electrostatic discharge. Take precautions to prevent ESD; use wrist straps,
grounded work surfaces and recognized anti-static techniques when handling SFP module.
Mitsubishi reserves the right to change the circuitry and specifications without notice at any time.
No liability is assumed as a result of their use or application. No rights under any patent accompany
the sale of any such product(s) or information.
UQ9-06-009 Ed:1.0 Date:10.Oct.2006
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