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PS21A79 Datasheet, PDF (1/10 Pages) Mitsubishi Electric Semiconductor – Dual-In-Line Package Intelligent Power Module
PS21A79
MITSUBISHI SEMICONDUCTOR < Dual-In-Line Package Intelligent Power Module>
PS21A79
TRANSFER-MOLD TYPE
INSULATED TYPE
MAIN FUNCTION AND RATINGS
z 3 phase inverter with N-side open emitter structure
z 600V / 50A (CSTBT)
APPLICATION
z AC100 ~ 200Vrms class, motor control
INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS
● For P-side : Drive circuit, High voltage high-speed level shifting, Control supply under-voltage (UV) protection
● For N-side : Drive circuit, Control supply under-voltage protection (UV), Short circuit protection (SC),
● Fault signaling : Corresponding to SC fault (N-side IGBT), UV fault (N-side supply)
● Temperature monitoring : Analog output of LVIC temperature
● Input interface : 3, 5V line, Schmitt trigger receiver circuit (High Active)
● UL Approved : File No. E80276
MAXIMUM RATINGS (Tj = 25°C, unless otherwise noted)
INVERTER PART
Symbol
Parameter
Condition
VCC
Supply voltage
Applied between P-NU,NV,NW
VCC(surge)
VCES
Supply voltage (surge)
Collector-emitter voltage
Applied between P-NU,NV,NW
±IC
Each IGBT collector current
TC= 25°C
±ICP
Each IGBT collector current (peak) TC= 25°C, less than 1ms
PC
Collector dissipation
TC= 25°C, per 1 chip
Tj
Junction temperature
CONTROL (PROTECTION) PART
Ratings
Unit
450
V
500
V
600
V
50
A
100
A
142
W
-20~+150
°C
Symbol
VD
VDB
VIN
VFO
IFO
VSC
Parameter
Control supply voltage
Control supply voltage
Input voltage
Fault output supply voltage
Fault output current
Current sensing input voltage
Condition
Applied between VP1-VPC, VN1-VNC
Applied between VUFB-VUFS, VVFB-VVFS, VWFB-VWFS
Applied between UP, VP, WP-VPC, UN, VN, WN-VNC
Applied between FO-VNC
Sink current at FO terminal
Applied between CIN-VNC
Ratings
Unit
20
V
20
V
-0.5~VD+0.5
V
-0.5~VD+0.5
V
1
mA
-0.5~VD+0.5
V
TOTAL SYSTEM
Symbol
Parameter
Condition
Ratings
Unit
VCC(PROT)
Self protection supply voltage limit
(Short circuit protection capability)
VD = 13.5~16.5V, Inverter Part
Tj = 125°C, non-repetitive, less than 2μs
400
V
TC
Module case operation temperature
(Note 1)
-20~+100
°C
Tstg
Storage temperature
-40~+125
°C
Viso
Isolation voltage
60Hz, Sinusoidal, AC 1minute, between connected all
pins and heat-sink plate
2500
Vrms
Note 1: Tc measurement point is described in Fig.1.
THERMAL RESISTANCE
Symbol
Parameter
Condition
Limits
Unit
Min. Typ. Max.
Rth(j-c)Q
Junction to case thermal
Inverter IGBT part (per 1/6 module)
-
-
0.88 °C/W
Rth(j-c)F
resistance
(Note 2)
Inverter FWDi part (per 1/6 module)
-
-
1.78 °C/W
Note 2: Grease with good thermal conductivity and long-term endurance should be applied evenly with about +100μm~+200μm on the contacting surface
of DIPIPM and heat-sink. The contacting thermal resistance between DIPIPM case and heat sink Rth(c-f) is determined by the thickness and the
thermal conductivity of the applied grease. For reference, Rth(c-f) is about 0.2°C/W (per 1/6 module, grease thickness: 20μm, thermal
conductivity: 1.0W/m•k).
March 2011
1