PM50RLB060 Datasheet, PDF (1/6 Pages) Mitsubishi Electric Semiconductor – MITSUBISHI INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE

MITSUBISHI <INTELLIGENT POWER MODULES>
PM50RLB060
FLAT-BASE TYPE
INSULATED PACKAGE
PM50RLB060
FEATURE
a) Adopting new 5th generation IGBT (CSTBT) chip, which
performance is improved by 1µm fine rule process.
For example, typical Vce(sat)=1.5V @Tj=125°C
b) I adopt the over-temperature conservation by Tj detection of
CSTBT chip, and error output is possible from all each con-
servation upper and lower arm of IPM.
c) New small package
Reduce the package size by 32%, thickness by 22% from
S-DASH series.
d) Current rating of brake part increased.
60% for the current rating of inverter part.
• 3φ 50A, 600V Current-sense IGBT type inverter
• 30A, 600V Current-sense regenerative brake IGBT
• Monolithic gate drive & protection logic
• Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
• Acoustic noise-less 3.7kW class inverter application
APPLICATION
General purpose inverter, servo drives and other motor controls
PACKAGE OUTLINES
7
19.75
3.25
16
3-2
120
106 ±0.25
66.5
16
16
3-2
3-2
15.25
6-2
Dimensions in mm
17
2-φ5.5
16
MOUNTING HOLES
1.5
3
1
5
9
13
19
2.5
7.75
B
U
V
W
44
44
44
44
19.5
22
23
23
23
98.25
19-s0.5
4-_φ2.5
9.5
Terminal code
1. VUPC
2. UFO
3. UP
4. VUP1
5. VVPC
6. VFO
7. VP
8. VVP1
9. VWPC
10. WFO
11. WP
12. VWP1
13. VNC
14. VN1
15. Br
16. UN
17. VN
18. WN
19. Fo
Apr. 2004