PM50B5LA060_11 Datasheet, PDF (1/10 Pages) Mitsubishi Electric Semiconductor – FLAT-BASE TYPE INSULATED PACKAGE

PM50B5LA060
APPLICATION
Photo voltaic power conditioner
PACKAGE OUTLINES
MITSUBISHI <INTELLIGENT POWER MODULES>
PM50B5LA060
FLAT-BASE TYPE
INSULATED PACKAGE
FEATURE
a) Adopting new 5th generation IGBT (CSTBT^TM) chip, which
performance is improved by 1µm fine rule process.
For example, typical Vce(sat)=1.55V @Tj=125°C
b) Over-temperature protection by detecting Tj of the CSTBT^TM
chips and error output is possible from all each conserva-
tion upper and lower arm of IPM.
c) New small package
Reduce the package size by 10%, thickness by 22% from
S-DASH series.
• 2φ 50A, 600V Current-sense IGBT type inverter
• 50A, 600V Current-sense Chopper IGBT
• Monolithic gate drive & protection logic
• Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
• UL Recognized Yellow Card No.E80276(N)
File No.E80271
Dimensions in mm
11
7
(19.75)
19.75 ^3.25 16
3-2
120
106
16
16
3-2
3-2
15.25
6-2
2-φ5.5
MOUNTING HOLES
16
3
1
5
9
13
19
6-M5 NUTS
B
10.75
32.75
U
V
W
23
23
19-■0.5
12
23
22
+
–
1
0.5
Terminal code
1. VUPC
2. UFO
3. UP
4. VUP1
5. VVPC
6. VFO
7. VP
8. VVP1
9. NC
10. NC
11. NC
12. NC
13. VNC
14. VN1
15. NC
16. UN
17. VN
18. WN
19. Fo
Oct. 2005