PM300CLA060 Datasheet, PDF (1/6 Pages) Mitsubishi Electric Semiconductor – FLAT-BASE TYPE INSULATED PACKAGE

PM300CLA060
MITSUBISHI <INTELLIGENT POWER MODULES>
PM300CLA060
FLAT-BASE TYPE
INSULATED PACKAGE
FEATURE
a) Adopting new 5th generation IGBT (CSTBT) chip, which
performance is improved by 1µm fine rule process.
For example, typical Vce(sat)=1.5V @Tj=125°C
b) I adopt the over-temperature conservation by Tj detection of
CSTBT chip, and error output is possible from all each con-
servation upper and lower arm of IPM.
• 3φ 300A, 600V Current-sense IGBT type inverter
• Monolithic gate drive & protection logic
• Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
• Acoustic noise-less 30kW class inverter application
APPLICATION
General purpose inverter, servo drives and other motor controls
PACKAGE OUTLINES
6.05
6-M5 Nuts
135
110±0.5
26
26
10.5
10.5
10.5
40.5
6.05
11.7
13
6
W
V
U
Dimensions in mm
13(Screwing Depth)
71.5
66.5
3.25 ^6-2 10 ^3-2 10 ^3-2 10 ^3-2 3.25
4-φ5.5
Mounting Holes
19 13
9
5
1
2-φ2.5
19- 0.5
30.15
11
LABEL
4
Terminal code
1. VUPC 6. VFO
2. UFO 7. VP
3. UP 8. VVP1
4. VUP1 9. VWPC
5. VVPC 10. WFO
11. WP 16. UN
12. VWP1 17. VN
13. VNC 18. WN
14. VN1 19. Fo
15. NC
Apr. 2004