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M68762SL Datasheet, PDF (1/1 Pages) Mitsubishi Electric Semiconductor – Silicon Bipolar Power Amplifier, 350-400MHz 30W FM Mobile
OUTLINE DRAWING
3+/-0.3
7.25+/-0.8
66+/-0.5
60+/-0.5
51.5+/-0.5
MITSUBISHI RF POWER MODULE
M68762SL
Silicon Bipolar Power Amplifier, 350-400MHz 30W FM Mobile
Dimensions in mm
BLOCK DIAGRAM
2
3
4
12
3
phi 0.45
+/-0.2
2-R2+/-0.5
4 56
12+/-1
16.5+/-1
33.0+/-1
43.5+/-1
55.5+/-1
1
5
6
PIN:
1 Pin : RF INPUT
2 Vcc1: 1st. DC SUPPLY
3 Vcc2: 2nd. DC SUPPLY
4 Vcc3: 3rd. DC SUPPLY
5 Po : RF OUTPUT
6 GND : FIN
H3
MAXIMUM RATINGS (Tc=25deg C UNLESS OTHERWISE NOTED)
SYMBOL
PARAMETER
CONDITIONS
Vcc
SUPPLY VOLTAGE
ZG=ZL=50 ohms
Icc
TOTAL CURRENT
ZG=ZL=50 ohms
Pin
INPUT POWER
Vcc1<12.5V, ZG=ZL=50 ohms
Po
OUTPUT POWER
Vcc1<12.5V, ZG=ZL=50 ohms
Tc(OP)
OPERATION CASE TEMPERATURE ZG=ZL=50 ohms
Tstg
STORAGE TEMPERATURE
Note:Above parameters are guaranteed independently.
RATINGS
17
10
600
40
-30 to +110
-40 to +110
UNIT
V
A
mW
W
deg. C
deg. C
ELECTRICAL CHARACTERISTICS (Tc=25deg.C UNLESS OTHERWISE NOTED)
SYMBOL
PARAMETER
TEST CONDITIONS
f FREQUENCY RANGE
Po OUTPUT POWER
Efficiency TOTAL EFFICIENCY
2fo 2nd HARMONIC
VCC=12.5V,
Pin=0.3W,
3fo 3rd HARMONIC
VSWR in INPUT VSWR
ZG=ZL=50 ohms
- STABILITY
(note 1)
ZG=50 ohms, VCC1=5-12.5V, Vcc2=Vcc3=10-16V
(Vcc1<Vcc2=Vcc3)
Po<40W (Pin control), Load VSWR < 3.0:1(all phase)
VSWRT LOAD VSWR TOLERANCE VCC=15.2V,Po=30W(Pin control)
ZG=50 ohms, LOAD VSWR=20:1
NOTE: Above parameters, ratings, limits and conditions are subject to change.
NOTE1: Stability is tested by sampling test (10pcs/LOT)
LIMITS
MIN
MAX
350
400
30
40
-30
-30
3.5
No parasitic
oscillation
No degradation
or destroy
UNIT
MHz
W
%
dBc
dBc
-
-
-
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead
to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit
designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable
material or (iii) prevention against any malfunction or mishap.