4D470 Datasheet, PDF (1/3 Pages) Mitel Networks Corporation – PIN Array(Parallel Datacom, Telecom)

PRODUCT INFORMATION
840nm
4D470
PIN Array
Parallel Datacom, Telecom
PRELIMINARY/^␤
This device consists of a 4-channel PIN
Photodiode array in a miniature sur-
face-mountable MT package. It is
based on a unique combination of self-
alignment technology and direct opti-
cal coupling to fiber, resulting in opti-
mum coupling efficiency without need
for active alignment. Applications
include parallel Fibre Channel and
optical interconnect inter/intra-board.
And it matches the 4D469 VCSEL
Array.
Optical and Electrical Characteristics (25°C Case Temperature)
PARAMETER
SYMBOL MIN. TYP. MAX. UNIT TEST CONDITION
Responsivity
R
0.45
A/W ␭=850nm
Bandwidth (3dBel)
f_c
2
GHz R_L=50⍀
Capacitance
C
1
pF f=1MHz
Dark Current
Crosstalk
I_d
0.4
nA
X
-30
dBel ␭=850nm (Note 1)
Test Condition: V_R=3.3V or 5V. Fiber Ribbon: 50/125 GI, NA=0.2 or 62.5/125 GI, NA=0.275.
Note 1: Crosstalk between adjacent channels operating at 2GHz.
Absolute Maximum Ratings
PARAMETER
Storage Temperature
Operating Temperature
Reverse Voltage
Soldering Temperature (2mm from the case for 10 sec)
SYMBOL
T_stg
T_op
V_R
T_sld
LIMIT
-40 to +85ЊC
0 to +70ЊC
20V
260ЊC
METAL SHIELD
CATHODE
CATHODE
ANODES
FRONT VIEW
Thermal Characteristics
PARAMETER
SYMBOL MIN. TYP. MAX.
Temperature Coefficient - Dark Current dI_d/dT_j
5
UNIT
%/ЊC
METAL SHIELD
HEAT SINK MT GUIDE PINS
LEADS
SIDE VIEW
The cathode is connected to the metal shield
PIN Array in MT Package
13628.11 1999-01-13
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