XB1006-BD Datasheet, PDF (8/11 Pages) Mimix Broadband – 18.0-38.0 GHz GaAs MMIC Buffer Amplifier

18.0-38.0 GHz GaAs MMIC
Buffer Amplifier
February 2008 - Rev 25-Feb-08
Mechanical Drawing
1.298
(0.051)
0.853
(0.034)
2
0.950
1
(0.037)
1.453
(0.057)
3
B1006-BD
4
0.376
(0.015)
6
5
0.0
0.0
0.671
(0.026)
1.270
(0.050)
2.000
(0.079)
(Note: Engineering designator is 28LN3UA0102)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.612 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (RF Out)
Bond Pad #5 (Vg2)
Bond Pad #6 (Vg1)
Bias Arrangement
Vd1
Vd2
RF In 1
2
3
Bypass Capacitors - See App Note [2]
4 RF Out
6
5
Vg1
Vg2
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 8 of 11
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.