XB1004 Datasheet, PDF (7/10 Pages) Mimix Broadband – 16.0-30.0 GHz GaAs MMIC Buffer Amplifier

16.0-30.0 GHz GaAs MMIC
Buffer Amplifier
April 2005 - Rev 01-Apr-05
Mechanical Drawing
1.500
(0.059)
1.290
(0.051)
2
1.892
(0.074)
3
B1004
0.798
1
(0.031)
4
0.798
(0.031)
0.0
0.0
10 9 8 7 6 5
0.958
1.359
1.760
(0.038) (0.054) (0.069)
1.158
1.560
1.958
(0.046) (0.061) (0.077)
2.330
(0.092)
(Note: Engineering designator is 22LN3UA0279)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.165 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (RF Out)
Bond Pad #5 (Vg2c)
Bond Pad #6 (Vg2b)
Bond Pad #7 (Vg2a)
Bond Pad #8 (Vg1c)
Bond Pad #9 (Vg1b)
Bond Pad #10 (Vg1a)
Bias Arrangement
Vd1,2
Bypass Capacitors - See App Note [2]
Vd1,2
2
3
RF In 1
4 RF Out
RF In
RF Out
10 9 8 7 6 5
Vg1,2
Vg1c, Vg2c
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 7 of 10
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
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