XR1005 Datasheet, PDF (5/9 Pages) Mimix Broadband – 19.0-26.0 GHz GaAs MMIC Receiver

19.0-26.0 GHz GaAs MMIC
Receiver
April 2006 - Rev 10-Apr-06
Mechanical Drawing
1.945
(0.077)
1.678
(0.066)
2
1.608
1
(0.063)
2.478
(0.098)
3
3.278
(0.129)
4
R1005
5
1.488
(0.059)
0.0
0.0
10
9
87
1.678
(0.066)
2.478
(0.098)
3.077
(0.121)
3.278
(0.129)
(Note: Engineering designator is 22REC0393)
6
3.677 ^3.970
(0.145) ^(0.156)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.787 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (IF1)
Bond Pad #4 (Vd2)
Bond Pad #5 (LO)
Bond Pad #7 (Vg2) Bond Pad #9 (IF2)
Bond Pad #6 (Vg2b) Bond Pad #8 (Vg2a) Bond Pad #10 (Vg1)
Bias Arrangement
Bypass Capacitors - See App Note [2]
Vd1
RF 1
Vd2
IF1
2
3
4
5 _LO
Vd2
Vd1
IF1
RF
LO
XR1005
Vg1
10
9
87
6
IF2
Vg2
IF2
Vg1 ^Vg2
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 5 of 9
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
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