XR1002 Datasheet, PDF (5/10 Pages) Mimix Broadband – 18.0-34.0 GHz GaAs MMIC Receiver

18.0-34.0 GHz GaAs MMIC
Receiver
May 2006 - Rev 21-May-06
Mechanical Drawing 0.897
(0.035)
1.496
(0.059)
2.000
(0.079)
3
4
1.895
(0.075)
5
1.397
2
(0.055)
R1002
6
1.600
(0.063)
7
1.000
(0.039)
0.399
(0.016)
1
10
9
8
R1002
0.0
0.0
0.897
(0.035)
1.496
(0.059)
1.895
(0.075)
3.350
(0.132)
(Note: Engineering designator is 30KRP_03A)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.152 mg.
Bond Pad #1 (Vg1)
Bond Pad #2 (RF)
Bond Pad #3 (Vd1)
Bond Pad #4 (Vd2)
Bond Pad #5 (IF1)
Bond Pad #6 (Vg4)
Bond Pad #7 (LO)
Bond Pad #8 (IF2)
Bond Pad #9 (Vg3)
Bond Pad #10 (Vg2)
Bias Arrangement
Vd1,2
IF1
3
4
5
RF 2
6
Vg4
7 LO
Bypass Capacitors - See App Note [2]
Vd1,2
Vg4
IF1
RF
LO
1
Vg1,2
10
9
8
R1002
IF2
Vg3
IF2
Vg3
Vg1,2
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 5 of 10
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.