XP1015-BD_10 Datasheet, PDF (5/8 Pages) Mimix Broadband – 43.5-46.5 GHz GaAs MMIC

43.5-46.5 GHz GaAs MMIC
Power Amplifier
January 2010 - Rev 22-Jan-10
Mechanical Drawing
4.630
(0.182)
1.226
(0.048)
2
1.725
(0.068)
2.225 2.625
(0.088) (0.103)
3
4
5
3.225
(0.127)
6
3.827
(0.151)
7
P1015-BD
2.620
(0.103)
1
8
2.006
(0.079)
XP1015-BD
0.0
14
13
12
11
10
9
0.0
1.226
1.725
2.225 2.625
3.225
3.827
4.650
(0.048)
(0.068) (0.088) (0.103)
(0.127)
(0.151)
(0.183)
(Note: Engineering designator is 44MPA0475)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 13.349 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd3B)
Bond Pad #10 (Vg3B)
Bond Pad #11 Vd2B)
Bond Pad #12 (Vg2B)
Bond Pad #13 (Vd1B)
Bond Pad #14 (Vg1B)
Bias Arrangement
Vg1
Vg2
Vg3
2
3
4
5
6
7
Bypass Capacitors - See App Note [2]
RF In 1
8 RF Out
XP1015-BD
14
13
12
11
Vd1
10
9
Vd2
Vd3
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 5 of 8
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
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